Wafer batch ? from ? (355-405µm, N doped -P-, 40 Ohm.cm, SSP, <111>)
HF:ODI 1:20, 1'
rinçage ODI 1'
Ti 10 / Al 25 (target Tc = 920 mK)
Pumped 2h DEGAS sources - Ti 0.5nm/s P raises > 2e-7 - Al 2nm/s 3.5e-7 EVAPORATION - Ti pump m @ 0.2nm/s -> P_ch = 3.8e-8 / P_sas = 5.4e-8mb -> P_ch = 3.4e-8 / P_sas = 5.1e-8mb gun off - Ti 10.8nm @ 0.5nm/s, 0°, spin 16°/s. P_evap = 4.0 / 5.8e-8 -> 3.4/ 4.4e-8 (gun off) - Al 25.6nm @ 1nm/s, 0°, spin 16°/s. P_evap = 1.2 / 1.4e-7 5'30 between end of Ti (shutter close) and beginning of Al (shutter open) (skept wait time after Ti ramp down)
Wafer batch G214 from ? (350µm, intrinsic, 17.5-20 kOhm.cm, DSP, <111>)
HF:ODI 1:20, 1'
rinçage ODI 1'
Ti 33 / Al 25 (target Tc = 600 mK)
Pumped over night with valve open -> 7.7e-8mb (sas: 9.0e-8) -> 6.0e-8mb (sas: 8.0e-8) after filling N2 trap DEGAS sources - Al 2nm/s 7e-7 @ 350mA (1.9) -> 1.5e-7 gun off - Ti 0.5nm/s P decreases to 4e-8 on both ch and sas at beginning of crucible heat (@38mA, no rate) -> 3.1e-8 (4e-8) gun off EVAPORATION - Ti pump m @ 0.2nm/s -> P_sas = 3.1e-8 / P_ch = 3.2e-8mb gun off - Ti 33.7nm @ 0.5nm/s, 0°, spin 16°/s. P_evap = 3.7 / 4.2e-8 -> 3.0/ 2.8e-8 (gun off) - Al 25.4nm @ 1nm/s, 0°, spin 16°/s. P_evap = 1.1 / 1.1e-7 -> 5e-8/ 9e-8 (gun off) 5'50 between end of Ti (shutter close) and beginning of Al (shutter open) (skept wait time after Ti ramp down)
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