Clean Room: Machines

Clean Room: MachinesEdit

Lithography

Preparation

Spin coaters (LPN)
Spin coaters (SPEC)

e-beam lithography

JEOL (LPN)
Vistec (LPN)

UV lithography

MJB3 (LPN, SPEC, IEF)
MJB4 (LPN, SPEC, IEF)
other

Thin film Processing

Deposition

Plassys MEB 550 (LPN):  e-gun; ion gun; Ti, Cr, Ni, Au, Ge, Ag, Al
BEL 310 (LPN) : joule; ion gun; Al, In, perso
SCM 450 (LPN) : e-gun; ion gun; Ti, Cr, Ni, Au, Ge

Thermal treatments

Fast bake AET oven (LPN)
Silicon oxydation and polymer bake AET oven (LPN)

Etching

RIE Nextral (LPN)
RIE (Spec)
IBE (LPN)

Characterization

4 Probes station (LPN)
Optical microsope (LPN)
SEMs
AFM (LPN)
AFM (SPEC)
Dektac (LPN)
Alpha Step IQ (LPN, SPEC)

Back-end technology

Polishing: Presi Mecapol P320 (SPEC, LPN)
Wire bonding (LPN)
Wire bonding (SPEC)
Dicing