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2014-05
2014-05Edit

    Lundi 07/05
    BPC2T2

    Test sample from BPC2 (23/04/2013), 10x3mm, CSNSM-type with no ground plane.

    Idea: Performing a Post-Expsoure-Bake (PEB) to reduce mechanical stress. This method is suggested for photoresists (Baking Steps MicroChemicals.pdf). Tg of PMMA = 95 - 106°C (http://www.microchem.com/pmma_faq.htm) and Tg of PMGI = 180-190°C (http://www.microchem.com/pmgi-lor_faq.htm). Exposing a larger number of the same structure to have good statistics.

    Exposure: The DC-structure (i.e. 4 times the main structure with island, two gates and SQUID each) will be exposed on a 10x3mm sample. One row and sixteen columns (labelled 1-16, in 500um distance) gives 64 patterns to compare. 30kV, Spot 1.
    PEB: Cut chip in two and heat one half on the hot plate for 90" at 110°C with small beaker. Important: Measured temperture directly on hot plate (which is around 5°C lower than setpoint).
    dev: MIBK/IPA=90s, IPA=30s, ODI=15s, MIF726=60s, ODI=60s, Ethanol=15s. Gentle N2 dry.
    obtical microscope: The part without PEB looks fine but the one with PEB might be slightly underdeveloped in MIBK/IPA but it is difficult to say. Both samples have a similar sized undercut.
    Evap:  Ar milling (3mA, 505V) and TwoAngleAu.prg evaporation (+/- 22°), each 30 nm.
    Lift-Off: PG remover at 60°C
    Obs:

    BPCT2 No PEB.jpgBPC2T2 with PEB.jpg

    Top image is without PEB and bottom with PEB. None of the small structures (island and SQUID) was visible but it seems that the PEB increased already the larger structures (gates and lead) by around 100nm.

    To do: PEB with 95,100,105°C.

    mardi-mercredi 08-09/05
    BPC2T3

    Test sample from BPC2 (23/04/2013), 10x3mm, CSNSM-type with no ground plane.

    Idea: Same as for BPCT2 but at PEB with 95,100,105°C.

    Exposure: The DC-structure (i.e. 4 times the main structure with island, two gates and SQUID each) will be exposed on a 10x3mm sample. Three rows (labelled a,b,c and in 500um distance) and sixteen columns (labelled 1-16, in 500um distance) gives 192 patterns to compare.
    PEB: Cut chip into three and perform PEB for each temperatur (90") with small beaker. Important: Measured temperture directly on hot plate (which is around 5°C lower than setpoint).
    dev: MIBK/IPA=90s, IPA=30s, ODI=15s, MIF726=60s, ODI=60s, Ethanol=15s. Gentle N2 dry.
    obtical microscope: All look the same optically -> BPC2_T3_afterDevelopment.pdf
    Evap:  Ar milling (3mA, 505V) and TwoAngleAu.prg evaporation (+/- 22°), each 30 nm.
    Lift-Off: PG remover at 60°C
    Obs: All 192 patterns were observed and checked if there was any stress induced strain (short between island and crabe or between gate and crabe or if the left arm of the crabe was significantly wider than the right one or vice versa).

    CHIP95.jpgCHIP100.jpgCHIP105.jpg

    - The structures did not increase in width for different PEB temperatures. (see "A6", "C4" and "B13" in BPC2_T3.zip)

    cracked 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
    a 0 0 1 4 0 0 3 3 4 4 3 4 0 0 0 0
    b 0 1 0 0 0 0 0 0 0 1 0 1 0 0 0 0
    c 2 2 2 2 3 2 2 3 3 4 2 2 0 0 1 0
                                     
                                     

    on top of
    Al- Ti-Au

    1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
    a 0 0 0 4 4 0 0 0 0 0 4 2 0 0 0 0
    b 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
    c 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
                                     
    corr 1 0,87 0,87 1 0 1 0,19 0,5 0,28 0,5 0,98 0,76     1  

    - It is more likely to find cracks if the structure is on top of Al-Ti-Au than on the substrate itself
    - half of the structures of row c is on top of the AlTi and the other half on the SiOx substrate which supports the correlation:
    C5ALL.jpgC6ALL.jpgC12ALL.jpgC13ALL.jpg
    C5 is on the 95°C chip, C6 and C12 on the 100°C chip, C13 is on the 105°C chip. Note that the white area on the C5 images comes from the cleaving. For the 95°C chip: the two structures on top of Al-Ti-Au had consistently cracks whereas the two on the substrate were fine. For the 100°C chip: same as for the 95°C chip but with a massively increased undercut for all structures which are on top of Al-Ti-Au, this might be caused by an adhesion problem of the PMGI on the gold. For the 100°C chip: All four structures of row c look fine.
    -It is likely that the resist thickness is different on top of the Al-Ti-Au than on top of the substrate (i.e. nonconformal) but one would then also expect a large difference in the displacement of the two evaporated layers which is not the case. (TI prime was used for before coating the e-beam resist which is meant to help to get a  more conformal film and improve adhesion). It is unlikely that PEB helps in this regard even if the 105°C-chip looks best.
    -Vivien adds a small rectangle next (around 1um) to the area where they usually observe cracks and it worked for them but they have little islands close to the junctions. We do not want that for our design.
    -contacted MicroChem with the following response:

    "Ok, it does seems like the PMGI may be cracking from stress, underneath the PMMA. Both the fact that the PMGI is baked below its Tg and the thermal shock from the application of the PMMA and evaporation in spin coating may be a little too much for the PMGI which is unable to relieve the stress.

    One thing you may want to do is spin the PMMA at lower spin-speeds, maybe around 3000rpm. This will reduce some of the stress induced to the underlying PMGI during spin-coating of the PMMA, and also allow to put down a thicker layer of PMMA on top of the PMGI (your PMMA layer is very thin compared to the underlying PMGI, we recommend going thicker).
    Are you doing a standard lift-off process, i.e. are you removing the PMGI/PMMA/Metal stack after the metal deposition? Do the cracks actually have a negative impact on the resulting final metal deposition, i.e. what is it about the cracks that is undesirable?
     
    If the above does not help and this remains a serious issue for you, you may actually want to consider increasing the PMGI bake temperature to get above the Tg, but this will of course affect the resulting dissolution rate. An alternative would be to try using an LOR A instead of the PMGI SF18, and go higher in soft bake temperature to help relieve some of the stress while remaining within the desired dissolution rate. LOR A have a higher dissolution rate compared to PMGI SF products.
     
    But reducing the spin-speeds for the application of the top PMMA and achieving a thicker PMMA layer may be enough. I hope this helps!"

    -Microchem mentioned that PMGI should stick on gold without problems. Furthermore, Denis used LOR A (which is PMGI) and having the same issue. Also we tried PMGI above Tg but the dissolution rate during development is too low even by applying deep-UV.
     
    mardi 13/05 (birthday sample)
    BPC2_S3

    Real sample from BPC2 (24/04/2013), 10x3mm, Quantronics-type with ground plane and single lumped-LC.

    Idea: Trying to make a real sample without changing anything in the design but without PEB.

    Exposure: 30 kV, Spot 1, using the new 20 nm diameter gold particle to perform focus.
    dev: MIBK/IPA=90s, IPA=30s, ODI=15s, MIF726=60s (refilled bottle in room P6 from the large bottle in the cleanroom), ODI=60s, Ethanol=15s. Gentle N2 dry.
    obtical microscope: All look the same optically.
    Evap:  Ar milling (3mA, 505V), Al 10nm +22deg with p=(8.0+/-0.3)x10^-7mbar, dynamic oxydation 150ubar for 10min, Ti-flash 150nm at 0.5nm/s, Al 60nm -22deg with p=(3.3+/-0.2)x10^-7mbar, O2 flush before venting.
    Lift-Off: PG remover at 60°C
    Obs: BPC2S3.zip. vertical parts did not work but it was possible to take some nice pictures of the fine Al-structure on top of the Al-Ti-Au sandwich. It is clearly visible that the ramp creates a smooth interface between the obtical- and e-beam structures.

     MAIN_2.jpgMAINA_6.jpg

     

    MAINA_2.jpgMAINA_3.jpg

    MAINA_4.jpg

     

    mercredi-jeudi14-15/05

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    BPC2_S4

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    Real sample from BPC2 (24/04/2013), 10x3mm, Quantronics-type with ground plane and single lumped-LC.

    Idea: Repeating BPC2_S3 but with the gold particles very close to the alignment markes (the ones at the edges of the sample) to improve the focussing of the e-beam.

    Exposure: 30 kV, Spot 1. Software crashed several times so the alignement had to be repeated.
    dev: MIBK/IPA=90s, IPA=30s, ODI=15s, MIF726=60s (refilled bottle in room P6 from the large bottle in the cleanroom), ODI=60s, Ethanol=15s. Gentle N2 dry and trying to blow along the island in order not to shift/rotate the hanging PMMA inside the loop of the crabe..
    obtical microscope: All look the same optically.
    Evap:  Ar milling (3mA, 505V) had to increase neutraliser current limit from 4A ti 4.2A due to "error -24", Al 10nm +22deg with p=(7.2+/-0.2)x10^-7mbar, dynamic oxydation 150ubar for 10min, Ti-flash 150nm at 0.5nm/s, Al 60nm -22deg with p=(3.0+/-0.2)x10^-7mbar, O2 flush before venting.
    Lift-Off: done on the 15/05/2014. PG remover at 60°C but it took around 45min (usually 20-25min) and several US bursts at low power.
    Obs: BPC2S4.zip. Resist residuals can be seen and it is not clear if one of the gates is connected to the island.

    MAIN_1.jpg

     

    mercredi-jeudi15/05

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    BPC2_S5

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    Real sample from BPC2 (24/04/2013), 10x3mm, Quantronics-type with ground plane and single lumped-LC.

    Idea: Repeating BPC2_S4.

    Exposure: 30 kV, Spot 1.
    dev: MIBK/IPA=90s, IPA=30s, ODI=15s, MIF726=60s (refilled bottle in room P6 from the large bottle in the cleanroom), ODI=60s, Ethanol=15s. Gentle N2 dry and trying to blow along the island in order not to shift/rotate the hanging PMMA inside the loop of the crabe..
    obtical microscope: All look the same optically.
    Evap:  Ar milling (3mA, 505V), Al 10nm +22deg with p=(7.7+/-0.4)x10^-7mbar, dynamic oxydation 150ubar for 10min, Ti-flash 150nm at 0.5nm/s, Al 60nm -22deg with p=(2.2+/-0.2)x10^-7mbar, O2 flush before venting.
    Lift-Off: PG remover at 60°C and several US bursts at low power.
    Obs: BPC2S5.zip. DC parts show a rotation of the inner part of the loop, clockwise for all of them. The main structure has a short between island and crabe arm, probably caused by mechanical stress.

    DC_BL1.jpgMAIN2.jpg

    To do: Embed crabe into the lead to which it is connected to such that the rotation of this free standing PMMA can not reach nearby PMMA and thus avoid sticking to it.

     

    venredi16/05

    Edit section

    BPC2_S6

    Edit section

    Real sample from BPC2 (24/04/2013), 10x3mm, Quantronics-type with ground plane and single lumped-LC.

    Idea: Similar to BPC2_S5 but embedding the crabe into the lead.

    Exposure: 30 kV, Spot 1.
    dev: MIBK/IPA=90s, IPA=30s, ODI=15s, MIF726=60s, ODI=60s, Ethanol=15s. Gentle N2 dry and trying to blow along the island in order not to shift/rotate the hanging PMMA inside the loop of the crabe..
    obtical microscope: All look the same optically.
    Evap:  Ar milling (3mA, 505V), Al 10nm +22deg with p=(8.2+/-0.3)x10^-7mbar, dynamic oxydation 150ubar for 10min, Ti-flash 150nm at 0.5nm/s, Al 60nm -22deg with p=(2.5+/-0.2)x10^-7mbar, O2 flush before venting.
    Lift-Off (done on 19/05/2014): PG remover at 60°C  for 1h and several US bursts at low power.
    Obs:  BPC2S6.zip

    MAIN3.jpgMAIN4.jpg

    -main structure looks fine with each JJ having an overlap-area of around 150x40 nm^2.
    -loop size is around 1.0 x 0.93 um^2.
    -DC part: tested different amounts of embedding into the top lead of the crabe. From 200nm of vertical embedding up to 500 nm (in100nm steps). All of them look fine so it is possible to embed even more.

    To do: Embed more of the crabe into the top lead and try one complete embedding.

    Bonding of BPC2S6 on the PCB on which BPC1_3 was bonded beforehand.

    BPC2S6_1.jpgBPC2S6_2.jpgBPC2S6_3.jpg

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    Fichiers 29

    FichierTailleDateAttaché par 
     Baking Steps MicroChemicals.pdf
    About PEB for photoresists
    277.77 Ko16:10, 7 Mai 2014Simon_SchmidlinActions
     BPC2_T3.zip
    BPC2T3 SEM images
    3.44 Mo17:22, 7 Mai 2014Simon_SchmidlinActions
     BPC2_T3_afterDevelopment.pdf
    BPC2_T3_afterDevelopment
    64.53 Ko16:10, 7 Mai 2014Simon_SchmidlinActions
     BPC2S3.zip
    BPC2S3 all images
    4.68 Mo18:52, 15 Mai 2014Simon_SchmidlinActions
     BPC2S4.zip
    BPC2_S4 all SEM images
    1657.64 Ko19:09, 15 Mai 2014Simon_SchmidlinActions
     BPC2S5.zip
    BPC2_S5 all images
    1450.82 Ko19:17, 15 Mai 2014Simon_SchmidlinActions
     BPC2S6.zip
    BPC2S6 all images
    3.08 Mo12:54, 19 Mai 2014Simon_SchmidlinActions
     BPC2S6_1.jpg
    BPC2S6 after bonding part 1/3
    582.81 Ko12:06, 20 Mai 2014Simon_SchmidlinActions
     BPC2S6_2.jpg
    BPC2S6 after bonding part 2/3
    480.32 Ko12:06, 20 Mai 2014Simon_SchmidlinActions
     BPC2S6_3.jpg
    BPC2S6 after bonding part 3/3
    552.93 Ko12:06, 20 Mai 2014Simon_SchmidlinActions
     BPC2T2 with PEB.jpg
    BPCT2 with PEB
    87.66 Ko16:43, 7 Mai 2014Simon_SchmidlinActions
     BPCT2 No PEB.jpg
    BPCT2 no PEB
    86.43 Ko16:43, 7 Mai 2014Simon_SchmidlinActions
     C12ALL.jpg
    BPC2T3 C12
    105.04 Ko17:37, 7 Mai 2014Simon_SchmidlinActions
     C13ALL.jpg
    BPC2T3 C13
    101.56 Ko17:37, 7 Mai 2014Simon_SchmidlinActions
     C5ALL.jpg
    BPC2T3 C5
    106.32 Ko17:37, 7 Mai 2014Simon_SchmidlinActions
     C6ALL.jpg
    BPC2T3 C6
    103.55 Ko17:37, 7 Mai 2014Simon_SchmidlinActions
     CHIP100.jpg
    BPCT3 100C
    166.5 Ko17:19, 7 Mai 2014Simon_SchmidlinActions
     CHIP105.jpg
    BPCT3 105C
    175.8 Ko17:19, 7 Mai 2014Simon_SchmidlinActions
     CHIP95.jpg
    BPCT3 95C
    165.36 Ko17:19, 7 Mai 2014Simon_SchmidlinActions
     DC_BL1.jpg
    BPC2_S5, BottomLeft DC part
    187.3 Ko19:17, 15 Mai 2014Simon_SchmidlinActions
     MAIN2.jpg
    BPC2_S5, main structure
    188.05 Ko19:17, 15 Mai 2014Simon_SchmidlinActions
     MAIN3.jpg
    BMC2S6 main structure
    231.12 Ko12:54, 19 Mai 2014Simon_SchmidlinActions
     MAIN4.jpg
    BMC2S6 main structure
    230.91 Ko12:54, 19 Mai 2014Simon_SchmidlinActions
     MAIN_1.jpg
    BPC2_S4 main structure
    188.12 Ko19:09, 15 Mai 2014Simon_SchmidlinActions
     MAIN_2.jpg
    BPC2S3 main structure
    172.02 Ko18:52, 15 Mai 2014Simon_SchmidlinActions
     MAINA_2.jpg
    BPC2S3 main structure with angle observation
    168.06 Ko18:52, 15 Mai 2014Simon_SchmidlinActions
     MAINA_3.jpg
    BPC2S3 main structure with angle observation
    166.8 Ko18:52, 15 Mai 2014Simon_SchmidlinActions
     MAINA_4.jpg
    BPC2S3 main structure with angle observation
    168.36 Ko18:52, 15 Mai 2014Simon_SchmidlinActions
     MAINA_6.jpg
    BPC2S3 main structure with angle observation
    163.19 Ko18:52, 15 Mai 2014Simon_SchmidlinActions
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