Lithography Masks

Lithography MasksEdit

2013-09 - 1st mask used for CPB

Polarity glass (green patterns are glass)

chips are 3.2 x 10.2mm

• DC pattern

- First step:
    evap + expo optical positive resist + etch
OR
    expo optical negative resist + evap + lift
- Second step:
    if necessary, (if the layer too thin), can make contacts on top
expo optical negative resists + evap + lift
polarity = chrome

• RF pattern

evap + expo optical positive resist + etc
OR
expo optical negative resist + evap + lift
motifs = chrome

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2nd mask used for CPB

step 1: resonator + transmission line                                                step 2: BCB (or dielectric)
Polarity glass (patterns are glass)                                                      Polarity glass (patterns are glass)


step 3: metallic bridges to connect center of coil resonator
Polarity Cr

chips are 3 x 10mm

litho step 1:
evap + expo optical positive resist + etch
OR
expo optical negative resist + evap + lift

litho step 2:
expo optical negative resist (BCB) + cure

litho step 3:
expo optical negative resist (probably with undercut layer) + evap + lift

• RF patterns

6 different types:
- 3 CS type, all with 2 resonators: 1 standard (shown below), 1 low capacitance, 1 high inductance (1 step more to make high Lkin gate)
- 3 Q type, 1 standard (2 res), 1 low cap (2res), 1 low cap (4 res)

• CPB patterns: exposure map

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2015-01 - Tests for the junctions oxidation + capacitors

Polarity Cr (green patterns are Cr)

• junctions tests

first step: expo negative optical resist + Ti/Au electrodes + lift
second step: e-beam litho with alignement marks in field x1000 corners

• capacitance tests

1st step left: expo negative optical resist + Ti/Au electrodes + lift
2nd step: expo negative resist (with undercut: if necessary, add LOL) + ALD (HfO2 or Al2O3 or SiO2) + gold or alu counter electrode + lift